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W24257 32K x 8 CMOS STATIC RAM
GENERAL DESCRIPTION
The W24257 is a slow speed, low power CMOS static RAM organized as 32768 x 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology.
FEATURES
*
Low power consumption: - Active: 325 mW (max.) - Standby: 75 W (max.) (LL-version) 150 W (max.) (L-version) * Access time: 70 nS (max.) * Single +5V power supply * Fully static operation
*
*
All inputs and outputs directly TTL compatible Three-state outputs * Battery back-up operation capability * Data retention voltage: 2V (min.) * Packaged in 28-pin 330 mil SOP, standard type one TSOP (8 mm x 13.4 mm )
PIN CONFIGURATIONS
BLOCK DIAGRAM
V DD
A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 V SS
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24
V DD #WE A13 A8 A9 A11 #OE A10 #CS I/O8 I/O7 I/O6 I/O5 I/O4
V SS A0 . . A14
DECODER CORE ARRAY
28-pin SOP
23 22 21 20 19 18 17 16 15
#CS #OE #WE
CONTROL DATA I/O
I/O1 . . I/O8
#OE A11 A9 A8 A13 #WE V DD A14 A12 A7 A6 A5 A4 A3
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28-pin TSOP
28 27 26 25 24 23 22 21 20 19 18 17 16 15
A10 #CS I/O 8 I/O 7 I/O 6 I/O 5 I/O 4 VSS I/O 3 I/O 2 I/O 1 A0 A1 A2
PIN DESCRIPTION
SYMBOL A0-A14 I/O1-I/O8 #CS #WE #OE VDD VSS DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Input Write Enable Input Output Enable Input Power Supply Ground
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Publication Release Date: February 2001 Revision A16
W24257
TRUTH TABLE
#CS H L L L #OE X H L X #WE X H H L MODE Not Selected Output Disable Read Write I/O1-I/O8 High Z High Z Data Out Data In VDD CURRENT ISB, ISB1 IDD IDD IDD
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential Allowable Power Dissipation Storage Temperature Operating Temperature RATING -0.5 to +7.0 -0.5 to VDD +0.5 1.0 -65 to +150 0 to +70 UNIT V V W C C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
Operating Characteristics
(VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C for LL/L; -20 to 85 C for LE)
PARAMETER Input Low Voltage Input High Voltage Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current Standby Power Supply Current
SYM. VIL VIH ILI ILO
TEST CONDITIONS VIN = VSS to VDD VI/O = VSS to VDD, #CS = VIH (min.) or #OE = VIH (min.) or #WE = VIL (max.) IOL = +4.0 mA IOH = -1.0 mA #CS = VIL (min.), I/O = 0 mA Cycle = min., Duty = 100% #CS = VIH (min.) Cycle = min., Duty = 100% #CS VDD -0.2V LL/LE L
MIN. -0.5 +2.2 -2 -2
TYP. -
MAX. +0.8 VDD +0.5 +2 +2
UNIT V V A A
VOL VOH IDD
2.4 -
-
0.4 70
V V mA
ISB ISB1
-
-
3 15 30
mA A A
Note: Typical characteristics are at VDD = 5V, TA = 25 C.
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W24257
CAPACITANCE
(VDD = 5V, TA = 25 C, f = 1 MHz)
PARAMETER Input Capacitance Input/Output Capacitance
SYM. CIN CI/O
CONDITIONS VIN = 0V VOUT = 0V
MAX. 6 8
UNIT pF pF
Note: These parameters are sampled but not 100% tested.
AC CHARACTERISTICS
AC Test Conditions
PARAMETER Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Output Load 0.6V to 2.4V 5 nS 1.5V CL = 100 pF, IOH/IOL = -1 mA/4 mA CONDITIONS
AC Test Loads and Waveform
R1 1000 ohm R1 1000 ohm 5V OUTPUT 100 pF Including Jig and Scope R2 660 ohm 5V OUTPUT 5 pF Including Jig and Scope R2 660 ohm
(For TCLZ, TOLZ, TCHZ, TOHZ , TWHZ , TOW)
3.0V
90% 10% 5 nS
90% 10% 5 nS
0V
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Publication Release Date: February 2001 Revision A16
W24257
AC Characteristics, continued (VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C for LL/L; -20 to 85 C for LE)
Read Cycle
PARAMETER SYMBOL W24257-70 MIN. Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Selection to Output in Low Z Output Enable to Output in Low Z Chip Deselection to Output in High Z Output Disable to Output in High Z Output Hold from Address Change These parameters are sampled but not 100% tested TRC TAA TACS TAOE TCLZ* TOLZ* TCHZ* TOHZ* TOH 70 10 5 10 MAX. 70 70 35 30 30 nS nS nS nS nS nS nS nS nS UNIT
Write Cycle
PARAMETER SYMBOL W24257-70 MIN. Write Cycle Time Chip Selection to End of Write Address Valid to End of Write Address Setup Time Write Pulse Width Write Recovery Time Data Valid to End of Write Data Hold from End of Write Write to Output in High Z Output Disable to Output in High Z Output Active from End of Write These parameters are sampled but not 100% tested #CS, #WE TWC TCW TAW TAS TWP TWR TDW TDH TWHZ* TOHZ* TOW 70 60 60 0 45 0 30 0 0 MAX. 30 30 nS nS nS nS nS nS nS nS nS nS nS UNIT
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W24257
TIMING WAVEFORMS
Read Cycle 1
(Address Controlled)
TRC Address TOH DOUT TAA TOH
Read Cycle 2
(Chip Select Controlled)
#CS TACS TCHZ TCLZ D OUT
Read Cycle 3
(Output Enable Controlled)
T RC Address T AA #OE
T AOE #CS TOLZ
TOH
T ACS D OUT T CLZ
TOHZ T CHZ
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Publication Release Date: February 2001 Revision A16
W24257
Timing Waveforms, continued
Write Cycle 1
TW C Address TW R #OE
TC W #CS TA W #WE TAS TO H Z D OUT TD W DIN TD H TWP
(1, 4)
Write Cycle 2
(OE = VIL Fixed)
T WC Address TC W #CS TA W #WE TAS TWP TW H Z D OUT (1, 4) TO H (2) TO W (3) TW R
TD W D IN
TDH
Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured 500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.
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W24257
DATA RETENTION CHARACTERISTICS
(TA = 0 to 70 C for LL/L; -20 to 85 C for LE )
PARAMETER VDD for Data Retention Data Retention Current
SYM. VDR
TEST CONDITIONS #CS VDD -0.2V VDD = 3V L
MIN. TYP. MAX. UNIT 2.0 0 TRC* 15 30 V A A nS nS
IDDDR #CS VDD -0.2V LL/LE TCDR TR See data retention Waveform
Chip Deselect to Data Retention Time Operation Recovery Time
TRC* = Read Cycle Time
DATA RETENTION WAVEFORM
DATA RETENTION MODE V DD 4.5V TC D R #CS VIH #CS1 > V D D -0.2V =
V D R > 2V =
4.5V TR V IH
ORDERING INFORMATION
PART NO. ACCESS OPERATING CURRENT TIME (nS) MAX. (mA) 70 70 70 70 70 70 70 70 70 70 70 70 STANDBY CURRENT MAX. (A) 15 30 15 15 30 15 OPERATING TEMP. (C) 0 to 70 0 to 70 -20 to 85 0 to 70 0 to 70 -20 to 85 PACKAGE
W24257S-70LL W24257S-70L W24257S-70LE W24257Q-70LL W24257Q-70L W24257Q-70LE
330 mil SOP 330 mil SOP 330 mil SOP Standard type one TSOP Standard type one TSOP Standard type one TSOP
Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure.
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Publication Release Date: February 2001 Revision A16
W24257
BONDING PAD DIAGRAM
6 A4 7 A3 5 A5 4 A6 3 2 1 30 29 28 27 26 25 24
A7 A12 A14 VDD VDD WEB A13
A8 A9 A11
AC5394 23
OEB
Y
X
8 A2 9 A1 10 11 12 13 14 15 16 17 18 19 20 21
22 A10
A0 I/O0 I/O1 I/O2 VSS
VSS I/O3 I/O4 I/O5 I/O6 I/O7 CSB
PAD NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
X -232.25 -351.70 -471.15 -590.60 -710.05 -829.50 -992.79 -992.79 -857.86 -738.41 -594.84 -451.06 -310.67 -171.78 24.45 151.80 298.07 443.28 588.20 732.84 871.11 992.75 992.75 810.09 690.64 571.19 451.74 332.29 120.25 -93.23
Y 1445.22 1445.22 1445.22 1445.22 1445.22 1445.22 1362.24 -1306.11 -1452.79 -1452.79 -1414.13 -1414.13 -1414.13 -1405.28 -1405.28 -1414.13 -1414.13 -1414.13 -1414.13 -1414.13 -1452.79 -1312.15 1373.67 1445.22 1445.22 1445.22 1445.22 1445.22 1444.65 1444.65
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to VDD or left floating in the PCB layout.
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Publication Release Date: January 2001 Revision A16
W24257
PACKAGE DIMENSIONS
28-pin SO Wide Body
Symbol
Dimension in Inches
Dimension in mm
Min. Nom. Max.
0.112 0.004 0.093 0.014 0.008 0.098 0.016 0.010 0.713 0.326 0.044 0.453 0.028 0.059 0.331 0.050 0.465 0.036 0.067 0.103 0.020 0.014 0.733 0.336 0.056 0.477 0.044 0.075 0.047 0.004 0 10
Min. Nom. Max.
2.85 0.10 2.36 0.36 0.20 2.49 0.41 0.25 18.11 8.28 1.12 11.51 0.71 1.50 8.41 1.27 11.81 0.91 1.70 2.62 0.51 0.36 18.62 8.53 1.42 12.12 1.12 1.91 1.19 0.10 0 10
28
15
e1
E
HE
L
Detail F
1 b 14
A A1 A2 b c D E e HE L LE S y Notes:
D
e1 c
A2 A
S
e
y
A1
LE
See Detail F Seating Plane
1. Dimension D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimension D & E include mold mismatch . and determined at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec should be based on final visual inspection spec.
28-pin Standard Type One TSOP
HD
Symbol
Dimension In Inches Min. Nom. Max.
0.047 0.002 0.035 0.007 0.004 0.461 0.311 0.520 0.040 0.008 0.006 0.465 0.315 0.528 0.022 0.020 0.024 0.010 0.000 0 3 0.004 5 0.028 0.006 0.041 0.011 0.008 0.469 0.319 0.536
Dimension In mm Min. Nom. Max.
1.20 0.05 0.95 0.17 0.10 11.70 7.90 13.20 1.00 0.20 0.15 11.80 8.00 13.40 0.55 0.50 0.60 0.25 0.00 0 3 0.10 5 0.70 0.15 1.05 0.27 0.21 11.90 8.10 13.60
D c
1
e
E
b
A2 A
A A1 A2 b c D E HD e L L1 Y
L L1
A1
Controlling dimension: Millimeters
Y
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Publication Release Date: January 2001 Revision A16
W24257
VERSION HISTORY
VERSION A12 DATE Nov. 1999 PAGE 1, 2, 7 4, 7 A13 A14 A15 A16 Apr. 2000 May 2000 Nov. 2000 Feb. 2001 7 1, 7, 8 8 2 1 2, 4, 7 DESCRIPTION Change the IDD, ISB, ISB1 Remove the W24257-10 spc. Typo correction in Standby Current Max.: mA->A Delete 28-pin DIP Package Add in Bonding Pad Diagram Modify Operating Power Supply Current (IDD) as 70 mA Add in TSOP Pin Configuration Add in LE grade
Headquarters
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City, No. 4, Creation Rd. III, No. 378 Kwun Tong Rd; Science-Based Industrial Park, Kowloon, Hong Kong Hsinchu, Taiwan TEL: 852-27513100 TEL: 886-3-5770066 FAX: 852-27552064 FAX: 886-3-5796096 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-27197006
Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab.
2727 N. First Street, San Jose, CA 95134, U.S.A. TEL: 408-9436666 FAX: 408-5441798
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-27190505 FAX: 886-2-27197502
Note: All data and specifications are subject to change withou t notice.
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